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dc.contributor.authorLook, Morgan
dc.contributor.authorHolmes, Wayne
dc.contributor.authorBirchmore, Roger
dc.date.accessioned2019-04-30T20:10:44Z
dc.date.available2019-04-30T20:10:44Z
dc.date.issued2019-01
dc.identifier.urihttps://hdl.handle.net/10652/4603
dc.description.abstractThis paper focused on the gathering of comparative temperature data from the ventilation systems installed in two buildings constructed to differing building standards. The Logging of temperature at 6 locations in the ventilation system ducting, plus current for the AC load was undertaken. An interval of 15 minutes for temperature was requested, however more frequent current measurements were required as short term variation had to be accounted for. At one of the sites the system proved to be reasonably reliable, with typical uptime of 7-14 days, the other site suffered from frequent drop-outs/crashes often within 24 hours of being manually reset.en_NZ
dc.language.isoenen_NZ
dc.publisherICEIC 2019 Secretariaten_NZ
dc.relation.urihttp://iceic.org/2019/en_NZ
dc.rightsICEIC 2019en_NZ
dc.subjectpower measurementsen_NZ
dc.subjecttemperatureen_NZ
dc.subjectstructural monitoringen_NZ
dc.subjectwireless sensingen_NZ
dc.subjectInternet of things (IoT)en_NZ
dc.subjectIoTen_NZ
dc.subjectESP8266 (WiFi microchip)en_NZ
dc.subjectventilationen_NZ
dc.titleReliability of wireless sensors using low cost WiFi chipsets for structural monitoringen_NZ
dc.typeConference Contribution - Paper in Published Proceedingsen_NZ
dc.date.updated2019-04-17T14:30:07Z
dc.subject.marsden120202 Building Science and Techniquesen_NZ
dc.identifier.bibliographicCitationLook, M., Holmes, W., & Birchmore, R. (2019). Reliability of wireless sensors using low cost WiFi chipsets for Structural Monitoring. 18th International Conference on Electronics, Information, and Communication (ICEIC 2019), (pp. 227-230).en_NZ
unitec.publication.spage227en_NZ
unitec.publication.lpage230en_NZ
unitec.publication.titleInternational Conference on Electronics, Information and Communication (ICEIC) 2019en_NZ
unitec.conference.title18th International Conference on Electronics, Information, and Communication (ICEIC 2019)en_NZ
unitec.conference.orgInstitute of Economics and Industrial Engineering (IEIE)en_NZ
unitec.conference.orgInstitute of Electrical and Electronics Engineers (IEEE)en_NZ
unitec.conference.locationPullman Hotel, Auckland, New Zealanden_NZ
unitec.conference.sdate2019-01-23
unitec.conference.edate2019-01-24
unitec.peerreviewedyesen_NZ
dc.contributor.affiliationUnitec Institute of Technologyen_NZ
unitec.identifier.roms62810en_NZ
unitec.identifier.roms63151en_NZ
unitec.identifier.roms63146en_NZ
unitec.publication.placeSeoul, Koreaen_NZ
unitec.institution.studyareaConstruction + Engineering


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