Browsing Construction + Engineering Journal Articles by Collaborator "Assiut University (Assiut, Egypt)"
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A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias
(Elsevier, 2016)The use of short Through-Silicon Vias (TSVs) in 3D integration Technology introduces a significant reduction in routing area, power consumption, and delay. Although, there are still several challenges in 3D integration ...