Browsing Construction + Engineering Journal Articles by Subject "090604 Microelectronics and Integrated Circuits"

Now showing items 1-3 of 3

A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias

Said, M.; Shalaby, A.; Madipour, Farhad; Morteza, B.; El-Sayed, M. (Elsevier, 2016)

The use of short Through-Silicon Vias (TSVs) in 3D integration Technology introduces a significant reduction in routing area, power consumption, and delay. Although, there are still several challenges in 3D integration ...
A reconfigurable data-path accelerator based on single-flux quantum circuits

Kataoka, H.; Honda, H.; Madipour, Farhad; Yoshikawa, N.; Fujimaki, A.; Akaike, H.; Takagi, N.; Murakami, K.J. (Institute of Electrical and Electronics Engineers (IEEE), 2014-03)

The single-flux quantum (SFQ) is expected to be a next-generation high-speed and low-power technology in the field of logic-circuits. CMOS as the dominant technology for conventional processors cannot be replaced with SFQ ...
A survey on big data processing infrastructure: evolving role of FPGA

Nunna, K.C.; Madipour, Farhad; Trouve, A.; Murakami, K.J. (InderScience Publishers, 2015)

In today’s commercial world, information is becoming a major economic resource thus leading to a statement - Information is wealth. It is a technical challenge for computer systems in managing and analyzing the large volumes ...