Browsing Construction + Engineering Journal Articles by Author "Shalaby, A."

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A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias

Said, M.; Shalaby, A.; Madipour, Farhad; Morteza, B.; El-Sayed, M. (Elsevier, 2016)

The use of short Through-Silicon Vias (TSVs) in 3D integration Technology introduces a significant reduction in routing area, power consumption, and delay. Although, there are still several challenges in 3D integration ...